ESC speaker to describe emerging bio-ASICs
The future of medical electronics could turn on the arrival of a new class of nanoscale chips that can monitor and deliver personalized therapies to human cells, according to a Berkeley researcher who will discuss the latest work in one of several sessions on medical electronics at the Embedded Systems Conference in April.
FCC may redraw spectrum allocations in broadband plan
A Federal Communications Commission director suggested the agency is exploring new ways to use a swath of spectrum to serve multiple users including utilities building smart electric grids as part of a national broadband plan the FCC will release March 17.
Marvell debuts passive optical network chips
Marvell is making its first foray into home broadband terminals, launching a new family of chips for passive optical networks as the number two player in the PON market, startup Teknovus Inc., is expected to be acquired by Broadcom Corp. or Cavium Networks.
Full-year chip sales fell 9% in 2009, says SIA
Global semiconductor sales were $226.3 billion in 2009, a decline of 9 percent from 2008 when sales were $248.6 billion, according to the Semiconductor Industry Association (SIA). The full-year decline was as had been expected in the last month but much less than had been predicted in the first months of 2009.
Point/Counterpoint: Apple's iPad, dud or must-have?
Now that the decibel level has finally diminished, it's time to take a hard look at Apple Inc.'s latest attempt to influence the direction of consumer electronics and, to a large extent, the way we live: the iPad.
Analyst rails against the fab-lite
The fabless chip vendors and pursuers of fab-lite manufacturing strategies are about to get a shock, according to Malcolm Penn, principal analyst with Future Horizons (Sevenoaks, England). Some companies could under-perform, others could be driven out of business in a market that should be booming for them; and all because they have lost control of manufacturing.
ESC: Saluting the unsung hero of product development
Test engineers should get as much credit as product designers, but they don't. Here's to the test engineer, whose daily challenges and strong will make them a valuable addition to the product development cycle.
Future Horizons sees 30% chip market boom
The worldwide chip market is set for two years of more than 20 percent growth and could even hit more than 30 percent growth in a single year, according to Malcolm Penn, the principal analyst and founder of the U.K. market analysis company Future Horizons (Sevenoaks, England).
Earnings roundup: ST, IDT, RF Micro post profits
STMicroelectronics, Altera and Integrated Device Technology became the latest chip makers to deliver quarterly numbers that beat consensus analyst expectations, while RF Micro Devices came up slightly short on revenue.
Top 10 growth markets for ICs
So what are the top-10 growth categories for 2010?
Optical RAM on chip, set to reduce telecoms power
Researchers from IMEC (Leuven, Belgium) and the department of information technology at Ghent University (INTEC) have published a paper on an optical random access memory integrated on a silicon chip with record low power consumption.
ISSCC 2010 goes beyond just "more and better digital"
There's lots of interesting analog design, topology, and performance at big solid-state event
Five trends in IC manufacturing
During an event, Bill McClean, president of IC Insights Inc. (Scottsdale, Ariz.), outlined five trends--and predictions--in the IC supply base.
Teardown: Moto Droid emulates other iPhone killers
Motorola's Droid smartphone includes hardware similar to other so-called "iPhone killers" and carries a bill of materials cost of $179.11, according to a teardown analysis conducted by market research firm iSuppli.
What was hot, cold and in between at CES
Here's our take on what was hot and what was not at CES. If you attended, or have strong opinions based on what you have been reading, we invite you to chime in with your own picks and pans.
About the RF DesignLine News Section
RF DesignLine's news section is the news./analysis resource for engineers building RF and microwave systems for 2G, 2.5G, 3G, 4G, EDGE, WCDMA, GPRS, GSM, HEDGE, WEDGE and WiMAX-based networks, as well as systems for Wi-Fi, Bluetooth, ZigBee, WiBree and UWB.
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